Hands-on Training On Chiplets: The Future Of Semiconductor Design

The Department of Electronics and Communication Engineering organized a Hands-on Training on “Chiplets: The Future of Semiconductor Design” on 19.09.2026 at 09:30 a.m. for III-Year B.E. ECE students at the ECE Smart Classroom II. The session was handled by Mr. M. Tamilvanan, Assistant Professor, Department of ECE, as the Resource Person. The training introduced students to the emerging concept of Chiplet-based semiconductor design and its applications in next-generation electronic systems. The session covered chiplet architecture, modular chip design, and advanced semiconductor integration. Students learned about the benefits of chiplets, including scalability, flexibility, performance, and cost efficiency. The hands-on activities provided practical exposure to chiplet-based systems and modern semiconductor technologies. The training enhanced students’ knowledge of VLSI design, heterogeneous integration, and advanced packaging. It also created awareness of emerging semiconductor technologies and career opportunities.